Ensuring the correct particle size, particle shape and zeta potential of abrasive slurries used for the cutting and polishing of semiconductor wafers is essential to ensure efficient manufacture and product quality: a single oversize particle can damage the surface of a whole wafer. Furthermore, the costs of this material mean that it has to be closely monitored so that abrasive slurry is replaced at the optimal time.

Malvern’s easy-to-use material characterization instrumentation can help you:

  • Optimize the dispersion of slurries
  • Prevent costly defects by detecting aggregates or oversized particles
  • Monitor the quality of a slurry and determine when it needs replacing
  • Optimize the recycling process of slurry components